JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. Japan Electronics and Information Technology Industries Association (JEITA) Standards EIAJ ED/ Environmental and endurance test methods for. EIAJ ED/ Test Method Ta=85°C, 85%RH, Vcc=80V, Vdd=6V. hrs. 0/ AC. EIAJ ED B Ta=°C,%RH.
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Miscellaneous test methods 2 Endurance tests Test by devices D: Please first have a look at the kinds of parameters involved and the conditions of the tests.
eisj The temperature of the air at a place separated by a distance sufficient to neglect the influence of the heat radiation from the specimen, when it is cooled by natural convection. But in SiC-SBDs, the occurrence of such failure is regarded as unlikely because the recovery current is extremely small. Portable appliance testing wikipedialookup Electromagnetic compatibility elajlookup Semiconductor device wikipedialookup.
The temperature of the air surrounding the specimen. Junichi Mitsuhashi Mitsubishi Electric Corp.
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Hence there are concerns about the possibility of a similar failure mode. The semiconductor devices provided for the tests. Because SiC does not have a long history as a semiconductor eed, and because it does not have much of a track record compared with Si power devices, there may not be much awareness of the level of its reliability. Tetsuji Matsuura Toshiba Corp. Climatic test methods C: However, the reader can consider the data that we shall present below.
The temperature at the reference point specified in the relevant specifications. There is a tendency for people to be hesitating over things that are new and untested. The standards related to integrated circuits IC and separate volume Appendix had been published, and the standards related to discrete devices SD separate volume Appendix and separate volume Appendix had been published.
Takahiro Ito Rohm Co. The visual inspection and the electrical and optical measurements that are carried out after finishing the tests. The heating treatment, equivalent to the actual mounting by soldering, which the specimens are submitted to.
Anyone who has studied the reliability of semiconductor devices and has actually performed evaluations will probably be familiar with these standards and conditions. When the specimen has outward appearance different from those ones shown in the figures, its directions are defined in the relevant specifications. Makoto Kanayama Shindengen Electric Mfg. The treatment which the specimens are submitted to before carrying out the initial measurements fiaj tests.
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Thank you for your participation! JEITA assumes absolutely no responsibility toward parties applying these standards or toward patent owners. Example, too many times and a few mistaking between the newest version eiwj old version. Osamu Nakayama Kawasaki Microelectronics, Inc.
A new and old classification method is shown in Comment Table 1. In conformity the relevant specifications when the specimen is cooled by forced convection. No part 7401 this standards may be reproduced in any form or by any means without prior permission in writing from the publisher.
The semiconductor devices that are made with the object of being mounted on printed circuit boards by means of the surface mounting method.
SiC Power Device
In particular, utmost attention should be paid to the precautions indicated in the detail specifications. The life tests and the strength tests 471 subdivided according to the revision frequency.
The junction 401 of the specimen. JEITA standards are established independently to any existing patents on the products, materials or processes they cover.
Portable appliance testing eiiajlookup. Electromagnetic compatibility wikipedialookup. Main revision points are as follow.
The pre-treatment, equivalent to the humidity absorption which occurs during the storage period until the actual mounting by soldering, which the specimens are submitted to before the soldering process.